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Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging

Zhang, Shuye

$150.00

Quantity
Product Details
Publisher
nstitution of Engineering & Technology
Publish Date
July 2025
Pages
199
Language
English
Type
TC
EAN/UPC
9781837241408
Weight
1.02 lb
BISAC Categories
Electronics - General
About the Author

Zhang, Shuye

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